Heller Semiconductor Packaging Applications & Products
| Applications |  Horizontal Reflow |  Vacuum Reflow |  Formic Reflow |  Pressure Curing |  Vertical Curing | Soldering Technology Advantages |
|---|---|---|---|---|---|---|
| Flip-Chip Die Attach | – Fluxless FA(Formic Acid) soldering (soldering 공정 후 flux cleaning 절차 불필요) | |||||
| Ball Attach (C4 BGA) | – Large pitch 상호 연결을 위한 horizontal reflow | |||||
| Micro-Bumping (C2 uBumps) | -향상된 co-planarity & solder wicking Fine pitch 상호 연결을 위한 Fluxless FA | |||||
| Lid Attach, TIM & Mold Curing | – TIM(Thermal Interface Material) 경화 시, low void 구현을 위한 pressure curing Pressure curing for low void Thermal Interface Materials (TIM) | |||||
| Direct Cu-Cu Hybrid Bonding | – Direct Cu-Cu bonding 을 위한 thermal annealing (Chamber 형태 장치) | |||||
| Underfill Epoxy-Resin Curing | – 경화 시, Low void 및 void reduction 효과 | |||||
| Multi-Die Bridge Interconnects | – Vacuum 적용으로, void 감소 및 high yield 실현 – Fluxless FA(Formic Acid) soldering (flux cleaning 절차 불필요) | |||||
| Co-Packaged Optics (CoP) | – Fluxless FA(Formic Acid) soldering (flux cleaning 절차 불필요) | |||||
| IGBT Power Devices | – Vacuum/Formic soldering 적용으로, Void 감소와 flux cleaning 절차 제거 | |||||
| RDL / Interposer Attach | – Fluxless FA(Formic Acid) soldering (flux cleaning 절차 불필요) | |||||
| Copper Clad Laminate (CCL) | – 자동화된 Panel Level reflow soldering oven | |||||
| Glass-Core Carrier (Panel) | – 자동화된 Panel Level reflow soldering oven |
